As the calendar inches closer to 2024, so does the highly anticipated launch of the Samsung Galaxy S24 series. With expectations running high, the flagship lineup is rumored to comprise three models: the Galaxy S24, Galaxy S24 Plus, and Galaxy S24 Ultra. While artificial intelligence (AI) is anticipated to play a significant role, the latest leak suggests a focal point on elevated performance for the upcoming Samsung flagship series.
A key player in this anticipated performance boost is the implementation of Fan-Out Wafer Level Packaging (FOWLP) technology, coupled with next-gen processors. This strategic move is poised to enhance the speed and efficiency of the devices significantly.
What sets FOWLP apart? Fan-Out Wafer Level Packaging is a sophisticated semiconductor integration packaging technology. This process ensures direct connectivity between the chips and the silicon wafer. The result is a reduction in chip size, thickness, and an overall improvement in performance.
According to reports from Korean Daily, Samsung has initiated mass production of FOWLP, signaling its integration into the latest Exynos 2400 chipset. Forbes further supports this claim, suggesting that the Exynos 2400 chipset, utilizing FOWLP, may power the Samsung Galaxy S24 and Galaxy S24 Plus.
Samsung has faced challenges in the performance of its Exynos chipsets in comparison to Qualcomm’s counterparts. FOWLP technology emerges as a potential solution, positioning itself as Samsung’s knight in shining armor. If successful, Samsung might introduce the Galaxy S24 and Galaxy S24 Plus, equipped with the Exynos 2400 SoC powered by FOWLP.
For the Samsung Galaxy S24 Ultra, expectations lean towards it being powered by the Snapdragon 8 Gen 3 for Galaxy processor, further elevating the series to new heights of performance. As the launch window approaches, anticipation builds for a groundbreaking release that could redefine Samsung’s flagship standards.